Abstract: |
Aiming at the microporosity in large aspect ratio charge by sequential solidification process, the interface morphology characteristics in controlled growth period and free solidification period was used as intermediate variable to establish a four layer correlation path from process parameters to shrinkage volume. TNT/RDX (33.8/65) and charge mold with aspect ratio of 5∶1 were selected for orthogonal simulation, range analysis and Spearman correlation coefficient calculation. The results show that: reducing water temperature, water entry speed and improving environmental heat transfer coefficient can increase the phase interface height and opening angle in the controlled growth period, thereby reducing the maximum solidification interval thickness in the free solidification period and ultimately reducing the shrinkage volume. The process parameter influence ranking is: water temperature, water entry speed, environmental heat transfer coefficient. Reducing water entry speed and improving environmental heat transfer coefficient can reduce the dependence on low water temperature. This study has revealed the influence mechanism of process parameters on the phase interface evolution and shrinkage of large aspect ratio charge in sequential solidification process, which can provide theoretical support for relevant process design. |